Development Process

This Tirraappendi development defines the phases and steps necessary to incorporate tSecure into a client's application, system, or product suite.

Through out the development process, Tirraappendi works closely with partners, OEMs and end-users of end product to mitigate risk and insure the success of the project.

Phase 1 – Requirements Definition & Functional Specification
The objective of the Requirements Definition & Functional Specification Phase is to identify first and foremost the business need and operational objectives of incorporating tSecure into your system.

In order to discover requirements and operational parameters, a systems engineering approach is used. This provides focus on things like business definitions, associated product and process workflows, architectural design, requirements, interfaces, tradeoffs, feasibility, design considerations, definition of precedence in the event of technical conflicts, integration & testing, manufacturing, infrastructure & logistics, system level testing and acceptance criteria.

The systems engineering approach is seen as the most cost effective means to ensure the system is “correct by design” and reduces the costs associated with changing requirements and technical obstacles or constraints encountered during design or testing phases.

The following activities are to be part of the detailed functional specification:

• Define the full system in an operational sense from subscriber management, to communication network compatibility, tSecure operation, and board level integration to the host equipment.
• Definition of interfaces.
• Paging frequencies, formats, and roaming requirements.
• System level software requirements and user interfaces.
• System security and data integrity.
• tSecure device functionality, performance, reliability, cost, and manufacturing.
• Identification of risks, dependencies and assumptions.
• Identification of applicable standards and compliance requirements.
• Identification of possible countermeasures and counter-countermeasures.
• Rough order of magnitude costing and trade-off precedence's
• Integration requirements and acceptance criteria.
• Stakeholder identification and definition of responsibilities.

The specification utilizes a tailored format for a DoD A-Specification for system level requirements. More detailed requirements (B-Specification content) applicable to the design of individual elements may be captured into appendices.

During the process of document development, Tirraappendi will work with potential stakeholders and authorities as necessary. In other words, we will set up a series of gate reviews where we will keep the customer up to date on progress being made and seek approval to take the next step.

Phase 2 – Detail Design
The objective of the Detail Design Phase is to develop the design in detail; how the various elements of the tSecure product will interact and be available to the host equipment into which it is incorporated.

The following activities are identified for the detailed design:

• Definition of the actual board level design of the tSecure product that will enable the product to be manufactured.
• Definition of board level integration to the host equipment.
• Definition of interfaces – specifically the definition of the full system application program interface (API) by which the host equipment may communicate with the tSecure device.
• Paging frequencies, formats, and roaming requirements.
• System level software requirements and user interfaces.
• System security and data integrity.
• In an operational sense from subscriber management, to communication network compatibility, tSecure operation, and board level integration to the host equipment.

Phase 3 – Manufacturing/Integration
The design specification will determine whether or not integration of tSecure into the host equipment will be able to use existing off-the-shelf chipsets or will require a unique application specific design. If a specialized chipsets is required, Tirraappendi will a.) Work with the client to allow them to define manufacturing operations or b.) Contract with a manufacturing firm to provide the chipset and deliver it to the client.

Regardless of the manufacturing process, a key element is that of failure rate. Circuits must have high reliability. Chips destined for incorporation into military equipment will need to meet mil-spec requirements.

Phase 4 – Deployment
This phase deals primary with actual use of the tSecure product. While initial applications of tSecure will likely be within the US, some deployments will include Europe, the Middle East, Australia and eventually the entire globe.

At this point, the incorporation of the tSecure device becomes less of an issue than that of support; Specifically, how clients will use (activate/deactivate) the tSecure device. This is open to negotiations.